Publications

Authors : Jayashree Nair, Vinod, Jincy

Publisher : First International Conference on Advances in Electrical and Computing Technologies 2019 | ICAECT

Authors : R. K. Kannan, , Govindaraju, M., Vaira Vignesh R.

Publisher : Journal of Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology (Published Online)

Authors : Muralikumar, J., Seelan, S.A., Vijayakumar, N., Dr. Vidhya Balasubramanian

Publisher : Journal of Intelligent Information Systems, Springer New York LLC

Authors : Sudharsan, V., Dr. Yamuna B.

Publisher : Journal of Telecommunications and Information Technology, National Institute of Telecommunications.

Authors : Ponnusamy, R., Selvaraj, S.C., Ramachandran, M.c, Murugan, P., Nambissan, P.M.G., Sivasubramanian, D.

Publisher : Crystal Growth and Design, American Chemical Society

Authors : M. Paidar, , Vaira Vignesh R., Moharrami, A., Ojo, O. O., Jafari, A., Sadreddini, S.

Publisher : Vacuum

Authors : N. Udayan, , Srinivasan, M. V., , Govindaraju, M., Vaira Vignesh R.

Publisher : Materials Today: Proceedings (Accepted). Elsevier, 2019

Authors : Anil,Aiswarya, Sreedha Sambhudevan, Sreekala,C. O., Shankar,Balakrishnan

Publisher : AIP Conference Proceedings

Authors : M. Haridas, Prof. Prema Nedungadi, Dr. Nirmala Vasudevan,, Sasikumar, L.,, Gutjahr, G, Raghu Raman

Publisher : 2019 IEEE Tenth International Conference on Technology for Education (T4E) .

Authors : R. K. Patnaik, N. Tamilarasan

Publisher : International Journal of Engineering and Advanced Technology, Blue Eyes Intelligence Engineering and Sciences Publication,

Authors : Bui, VT, Bonin, HW, Weir, RD, Shantanu Bhowmik

Publisher : SWISSBONDING 06: 20th International Congress of Adhesion and Bonding Technology

Authors : K. R. Unni, N. Tamilarasan

Publisher : IOP Conference Series: Materials Science and Engineering, Institute of Physics Publishing .