Authors : Thamilselvan, A., Govindan, K., Nesaraj, A.S., Maheswari, S.U., Oren, Y., Noel, M., James, E.J.
Publisher :Electrochimica Acta
Authors : Dr. Radhika N, Dr. Thirumalini S., Shivashankar, A.
Publisher :Transactions of the Indian Institute of Metals
Authors : S. Sasidharan, Rahul Puthucode, Dr. Radhika N, A. Shivashankar
Publisher :Materials Today: Proceedings
Authors : Rahul Sunny , Senthil Kumar D.
Publisher :Third International Conference on Materials and Manufacturing Enginnering (ICMME 2018) .
Authors : Suresh, M., Amritha, P.P., Mohan, A.K., Anil Kumar, V.
Publisher :Journal of Cyber Security and Mobility
Authors : Mohan, V.S., Sowmya V., Dr. Soman K. P.
Publisher :2018 5th International Conference on Signal Processing and Integrated Networks, SPIN 2018, Institute of Electrical and Electronics Engineers Inc.
Authors : Jayaprakash, C., Damodaran, B.B., Sowmya V., Dr. Soman K. P.
Publisher :2018 5th International Conference on Signal Processing and Integrated Networks, SPIN 2018, Institute of Electrical and Electronics Engineers Inc., Amity School of Engineering and Technology, Noida, India.
Authors : Denin Pius Joy, Shantanu Bhowmik
Publisher :Journal Materials Today: Proceedings
Authors : Reshma, R., Sowmya, V., Soman, K.P.
Publisher :Neural Computing and Applications, Springer London.
Authors : Unnikrishnan, A., Sowmya V., Dr. Soman K. P.
Publisher :Procedia Computer Science, Elsevier B.V .
Authors : P. Ritesh, Shanmugasundaram A.
Publisher :Transactions of the Institute of Metal Finishing, Taylor and Francis Ltd.,
Authors : Narayana, K.J., Bhattacharyya, K.
Publisher :2017 14th IEEE India Council International Conference, INDICON 2017