Publications

Publisher :RTEICT 2017 - 2nd IEEE International Conference on Recent Trends in Electronics, Information and Communication Technology, Proceedings

Publisher :IOP Conference Series: Materials Science and Engineering

Citation : B. K. Murugan, Balusamy, V., Dr. Padmanaban R., and Vaira Vignesh R., “Study of the effect of para ...

Publisher :Materials Today: Proceedings

Citation : Meena Belwal and Sudarshan, T. S. B., “A Study of Memory Access Patterns as an Indicator of Perfor ...

Publisher :Smart Innovation, Systems and Technologies, Springer Science and Business Media Deutschland GmbH

Citation : R. Harsh, Hitish Srivastav, Prabhat Balakrishnan, Vivek Saini, Senthilkumar D., Dr. Rajni K. S., and ...

Publisher :IOP Conference Series: Materials Science and Engineering,

Citation : J. Abhinavaram, Shanmugasundaram A., R. Prashanth, S. Jagadeesh, Dr. Sanjivi Arul, and R. Sellamuthu ...

Publisher :Indian Journal of Engineering and Materials Sciences, National Institute of Science Communication and Information Resources (NISCAIR),

Citation : Shekhar, S. A., Balaji, R., Jeyanthi, R., “Study of Control Strategies for a Non-Linear Benchmar ...

Publisher :International CET Conference on Control, Communication, and Computing

Citation : Dr. M. Ramu, Venugobal, P. R., Ramaswami, T. P., Jothi, S., and Chinnusamy, S., “Studies on the ef ...

Publisher :China Welding (English Edition)

Citation : Dr. Radhika N and Jefferson, J. A., “Studies on Mechanical and Abrasive Wear Properties of Cu-Ni-S ...

Publisher :Silicon, Springer Netherlands,

Citation : V. Venkatesh, Sriraam J., Bala Vignesh D., K., S., Dr. Ratna Kishore V., Dr. Srikrishnan A. R., Dr. ...

Publisher :Aerospace Science and Technology

Citation : S. Shalini, Prabavathy, N., Balasundaraprabhu, R., T. Satish Kumar, Velauthapillai, D., Balraju, P., ...

Publisher :Optik - International Journal for Light and Electron Optics, Elsevier.

Citation : Raman, R., Vachharajani, H. & Achuthan, K. Students motivation for adopting programming contests: In ...

Publisher :Education and Information Technologies.