Publication Type : Patents
Source : Volume US6462409 B1, Number US 09/876,259 (2002)
Url : http://www.google.com/patents/US6462409
Campus : Amritapuri
School : Centre for Cybersecurity Systems and Networks, School of Engineering
Center : Cyber Security, TBI
Department : cyber Security
Year : 2002
Abstract : pA semiconductor wafer polishing method and apparatus therefor are provided having a system housing and a robotic handling system for moving the semiconductor wafer between a belt module and a rotary module for respective linear and rotary polishing. A buff module and a cleaning module are provided in the system housing for buffing and cleaning the semiconductor wafer./p
Cite this Research Publication : Dr. Krishnashree Achuthan and Woo, C. Mei- Chu, “Semiconductor wafer polishing apparatus”, U.S. Patent US 09/876,2592002.
