Publisher : IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2018
Year : 2019
Abstract : This article presents the modeling of parallel coupled line interconnects in high speed RF applications. The modeling approach described in this paper generates a rational function representation of the coupled line interconnects. The model captures the significant electromagnetic effects between coupled line interconnects such as coupling and crosstalk which becomes prominent at higher frequencies. The model is also verified for different spacing between the coupled line interconnects. Further, the network equivalent of the model can be incorporated in any time domain system level simulations for more accurate studies and analysis. © 2018 IEEE.