Publication

Abstract : This paper deals with the numerical study on enhancement of heat transfer in microelectronic heat sink. Here, different configuration (inline and staggered) of fins were considered for the analysis. Enhancement of heat transfer was analysed in a forced convection environment and parameters were calculated for different inlet velocities of air ranging from 1 to 5 m/s. From the numerical analysis, we see that only the staggered circular and staggered circular dimpling were found to be effective in heat dissipation and staggered circular dimpling was found to possess highest heat flux rate and quality factor which were as expected. This was of the turbulence induced because of the dimpling causing a disturbance in the thermal boundary layer formed earlier, thereby increasing the molecular interactions. Dimpling caused more streamlined molecules and surface interactions effectively transferring more heat than other configurations. Hence, we observe that staggered circular dimpling fin is more effective than any other configuration