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Modeling Broadband RF Power Amplifiers Using A Modified Hammerstein Model

Publication Type : Conference Paper

Publisher : Proceedings of the 2018 IEEE International Conference on Communication and Signal Processing, ICCSP 2018

Source : Proceedings of the 2018 IEEE International Conference on Communication and Signal Processing, ICCSP 2018, Institute of Electrical and Electronics Engineers Inc., p.186-189 (2018)

Url : https://www.scopus.com/inward/record.uri?eid=2-s2.0-85057723100&doi=10.1109%2fICCSP.2018.8524425&partnerID=40&md5=51eb35aa8474c7ce2e6201b830955bd7

ISBN : 9781538635216

Keywords : Broadband amplifiers, Broadband wireless communications, Dynamic non-linear, Hammerstein model, Memory effects, Mobile telecommunication systems, Model performance, Phase characteristic, Power amplifiers, RF power amplifiers, Signal processing, Smoothing techniques, Wireless telecommunication systems

Campus : Bengaluru

School : School of Engineering

Department : Electronics and Communication

Year : 2018

Abstract : pRF power amplifiers PAs used for broadband wireless communication systems such as WCDMA, WiMAX and LTE exhibits a significant amount of dispersion in their amplitude and phase characteristic curves due to memory effects. The conventional Hammerstein model used for modeling RF PAs, characterizes such memory effects very accurately in their linear region and not in their nonlinear region. Hence, to accurately model such dynamic nonlinear characteristics, a new PA behavioral model based on a modified Hammerstein model is used in this article. The enhanced modeling capability of the modified Hammerstein model is validated using a class AB RF Power Amplifier. The results clearly indicate that, the modified Hammerstein model has better modeling performance than the conventional Hammerstein model. © 2018 IEEE./p

Cite this Research Publication : Sanjika Devi R V, Kumar, C. S. P., Chaitanya, M. K., Deepak, M. V., and Kurup, D. G., “Modeling Broadband RF Power Amplifiers Using A Modified Hammerstein Model”, in Proceedings of the 2018 IEEE International Conference on Communication and Signal Processing, ICCSP 2018, 2018, pp. 186-189.

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