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Publication Type : Conference Paper
Publisher : IOP Conference Series: Materials Science and Engineering
Source : IOP Conference Series: Materials Science and Engineering, Institute of Physics Publishing, Volume 225 (2017)
Keywords : Displacement analysis, Displacement model, Extreme plastic deformations, Finite element method, Forecasting, Functional performance, Milling (machining), Milling operation, Plastic deformation, Residual stresses, Surface residual stress, Von Mises stress, X ray diffraction, X-ray diffraction method
School : School of Engineering
Department : Mechanical Engineering
Year : 2017
Abstract : Materials when subjected to plastic deformations, stresses are induced in the material. The stresses that are induced in the material due to machining is very high due to extreme plastic deformation. The nature and magnitude of the stresses plays a vital role in the functional performance of the components. The stresses can be tensile or compressive. Sometimes the stress are beneficial sometimes it is not. The present work is to develop a 2D coupled temperature displacement analysis to predict the surface residual stresses that are induced due to milling operation. In this work the material considered is AISI 1045 steel and the tool that is used is HSS tool. The finite element model is used to predict the residual stresses and it is compared with the experimental results. The predict results are in agreement with the experimental results. The residual stresses where experimentally determined using X-Ray diffraction method. Finite element method helps us to remove costly experiments and the process is rather quick. Apart from the residual stresses, force, temperature, Von Mises stress can also be obtained from the developed model.
Cite this Research Publication : M. Pramod, Reddy, N. V., Talluru, V., Reddy, Y. G., and Prakash Marimuthu K., “Coupled temperature displacement model to predict residual stresses in milling process”, IOP Conference Series: Materials Science and Engineering, vol. 225. Institute of Physics Publishing, 2017.