Publication Type : Conference Paper
Publisher : ACM, NewYork
Source : In 2020 12th International Conference on Education Technology and Computers ICETC'20. ACM, NewYork, NY, USA, 239–245
Url : https://dl.acm.org/doi/10.1145/3436756.3437052
Campus : Coimbatore
School : School of Physical Sciences
Department : Mathematics
Year : 2020
Abstract : Over the past years, the number of students going abroad for higher studies and settling abroad has increased a lot in northern states of India mainly in Punjab whereas it's significantly less in south India. The purpose of this research is to find the reasons for the brain drain also analyzing the strategies used by south Indian universities so that those ideas can be implemented in Punjab so that the brain drain can be reduced. Using a credits composition analysis for two universities, this study analyzed that the College in Punjab had more credits towards practical and college in South India had more credit composition towards theory. This analysis gave us a result that Panimalar Engineering College has found a sweet spot in the composition of credits along with some other factors. Using a comparative analysis of various factors for various south Indian Universities along with Punjab University, we have found out that there are many other factors that also influence's the brain drains along with Industry Institute Relationship. We have found out the methodologies used by south Indian universities to prevent brain drain. This study definitively answers the question regarding reasons for brain drain in Punjab along with the solutions to overcome it. Further Detailed studies are needed along with the implementation of these ideas to develop preventative measures
Cite this Research Publication : Gulam B. Mustafa, Kadhiravan G, Venkatesh Vijay C, Malathi S, Subburaj S, and AshwanParanthaman. 2020. Bridging the Skill Gap Between Academia and Industry in Punjab: A Case Study. In 2020 12th International Conference on Education Technology and Computers ICETC'20. ACM, NewYork, NY, USA, 239–245. DOI: https://doi.org/10.1145/3436756.3437052