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Application of bandage repair systems in the power sector to restore pipeline integrity

Publication Type : Journal Article

Publisher : Elsevier

Source : International Journal of Pressure Vessels and Piping

Url : https://doi.org/10.1016/j.ijpvp.2024.105175

Campus : Chennai

School : School of Engineering

Department : Mechanical Engineering

Year : 2024

Abstract : This work explores the possibility of repairing damaged pressure piping systems using composite repair bandaging technology. Loctite technology from Henkel was selected from several existing methods and applied at the weld joint. To assess the performance of the bandage, a bore was made at the weld joint to simulate a replacement defect of the composite bandage. The bandage, along with the welded joints, was subjected to microstructural and macrostructural analysis, and mechanical and fire resistance tests were also performed. Based on the obtained results, it is concluded that the properties of the Loctite composite system are suitable for repairing pressure piping in the power industry. However, it is not always possible to use this repair method due to certain boundary conditions for its application, such as maximum pipe overpressure, the temperature of the internal medium and the environment, degradation of the repair system due to the medium being transferred and the environment, reduction of the pipe wall at the repair site, possible surface treatment before application of the system, etc. For these reasons, the repair system may be used for a temporary period (approved by the power plant operator), and the spot will then be repaired in the standard way by replacing parts of the pipeline during a planned equipment shutdown.

Cite this Research Publication : Jindrich Kozak, Lucie Krejcí, Ivo Hlavatý, Michal Bucko, Sergej Hloch, Martin Frysak, Madhulika Srivastava, Application of bandage repair systems in the power sector to restore pipeline integrity, International Journal of Pressure Vessels and Piping, (2024). doi: https://doi.org/10.1016/j.ijpvp.2024.105175 (SCIE; IMPACT FACTOR-3.0; WoS)

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