Electrodeposition of Lead-Free Solder Materials for Microelectronic Packaging
The primary objective of the project is to develop soft, compliant, lead-free, low-melting-temperature solder materials by electrodeposition. These materials are candidates to replace lead-tin alloys in flip-chip technology for microelectronic packaging.
Specifically, the goals are:
- Identify the optimum process conditions for electrodeposition of lead-free alloys such as tin-bismuth (SnBi) and tin-indium (SnIn).
- Demonstrate the feasibility of these alloys for microfabricating chip connection bumps on silicon substrates.
This is a collaborative project with Dr. Madhav Datta, Chief Scientist, Cooligy Precision Cooling, Emerson Network Power, Mountain View, CA, and Adjunct Professor, Department of Chemical Engineering and Materials Science, Amrita University, Coimbatore, India.
Lab Facilities
- Potentiostat/Galvanostat, Pine Instruments
- Rotating Disk Electrode Setup, Pine Instruments
- DC and Pulsed Power Supply, Dynatronix Inc.
- Diamond Saw and Accessories, Chennai Metco
- Grinder and Polisher, Chennai Metco
