Start Date: Tuesday, Mar 01,2011
School: School of Engineering, Coimbatore
The primary objective of the project is to develop soft, compliant, lead-free, low-melting-temperature solder materials by electrodeposition. These materials are candidates to replace lead-tin alloys in flip-chip technology for microelectronic packaging.
Specifically, the goals are:
This is a collaborative project with Dr. Madhav Datta, Chief Scientist, Cooligy Precision Cooling, Emerson Network Power, Mountain View, CA, and Adjunct Professor, Department of Chemical Engineering and Materials Science, Amrita University, Coimbatore, India.
Lab Facilities