Publication

Abstract : Electrochemical co-deposition of aluminium, zirconium and copper was investigated from a room temperature ionic liquid containing 2:1 weight ratio Aluminium Chloride - Triethylammine Hydrochloride (AlCl3-Et3NHCl) and acetylacetonates of copper and zirconium. The mechanism of deposition was studied using cyclic voltammetry (CV). Alloy films of thickness about 80 μm was obtained at constant potential of -1.8 V (vs Pt wire) on a gold substrate. The as deposited alloy films were characterized using scanning electron microscope (SEM) and energy dispersive X-ray spectroscopy (EDS). Adherent and shiny Al-Zr-Cu alloy deposits containing 7% of copper and 3% of zirconium were obtained. The crystalline nature of the deposited alloy was analyzed using XRD. The deposit obtained showed higher corrosion resistance than deposited aluminium and the binary alloys from this bath.