Back close

GIS-Based 3-D Slope Stability Modelling for Analysis of Rainfall Induced Landslides

Dept/Center/Lab: Amrita Center for Wireless Networks and Applications (AWNA)

Project Incharge:Dr. Sabari Ramesh
GIS-Based 3-D Slope Stability Modelling for Analysis of Rainfall Induced Landslides

Digital Elevation Models (DEM) of the study area are acquired and analyzed using ArcGIS PRO thereby deriving the slope angle, flow direction, soil depth, aspect, geomorphology and so on. Soil properties are obtained using laboratory and field tests. Giving this DEM as input, a 3D slope stability analysis is carried out using the TRIGRS model. The model is modified to incorporate both saturated and unsaturated soil conditions. Also, the data available from the existing landslide monitoring systems deployed at the sites are incorporated into the model. The Factor of safety of slopes at different periods from the start of rainfall event will be mapped. Thus, this model can be used to forecast the spatiotemporal distribution of rainfall induced landslides thereby contributing towards the development of a more efficient landslide early warning system.

Name of the Indian Collaborators

  • Prof. Maneesha V Ramesh, AWNA
  • Dr. Rakesh J pillai, Associate Professor, IIT Palakkad
  • Dr. Remya SN, Assistant Professor , ASF Ms Anjana Vishwanath, Research Scholar, AWNA

Related Projects

Development of Text / Language Independent Speaker Recognition System
Development of Text / Language Independent Speaker Recognition System
Machine Fault Identification : A Unified Approach
Machine Fault Identification : A Unified Approach
New and Efficient Photosensitizers for Nanocrystalline TiO2 Based Dye Sensitized Solar Cells
New and Efficient Photosensitizers for Nanocrystalline TiO2 Based Dye Sensitized Solar Cells
Studies on Probiotic Strains from Fermented Foods
Studies on Probiotic Strains from Fermented Foods
Durability of High Performance Nano Adhesive Bonding of Aluminium under Aerospace Environments
Durability of High Performance Nano Adhesive Bonding of Aluminium under Aerospace Environments
Admissions Apply Now