Publication Type : Conference Paper
Publisher : PIERS 2010 Cambridge - Progress in Electromagnetics Research Symposium, Proceedings
Source : PIERS 2010 Cambridge - Progress in Electromagnetics Research Symposium, Proceedings, Cambridge, USA, p.292-295 (2010)
ISBN : 9781934142141
Keywords : Attenuation factors, Bit error rate, Climatic conditions, Communication systems, Digital information, Electromagnetism, Frequency ranges, High bandwidth, High data rate, High frequency signals, Millimeter wave devices, Millimeter waves, Modulation schemes, Modulation techniques, Propagation mechanism, PSK systems, Quadrature phase shift keying, Received signals, Worst case
Campus : Coimbatore
School : School of Engineering
Center : Electronics Communication and Instrumentation Forum (ECIF)
Department : Electronics and Communication
Year : 2010
Abstract : Millimeter waves have opened a new door to next generation communication systems. These high-frequency signals are advantageous due to the high bandwidths, and hence, the high data rates they present. However, their main drawback is the presence of attenuation factors that adversely affect the quality of the received signal. We have described the various propagation mechanisms that lead to the attenuation of radio waves in the frequency range of 40 GHz for different modulation techniques such as m-PSK and m-FSK. The comparison shows that, as the number of signals needed to represent the digital information increases, the Bit Error Rate (BER) of the PSK system increases, while the BER of an FSK system decreases. We have concluded that BPSK, QPSK or 8FSK are the most advantageous modulation schemes in a practical communication system, under worst case climatic conditions.
Cite this Research Publication : P. Kumar and Dr. Jayakumar M., “Comparison of Bit Error Rate for propagation mechanisms of millimeter waves in a practical communication systems employing PSK and FSK”, in PIERS 2010 Cambridge - Progress in Electromagnetics Research Symposium, Proceedings, Cambridge, USA, 2010, pp. 292-295.