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Thermal Fatigue Behavior of Adhesive Bonding of Titanium for Aerospace Application (Invited Author)

Publication Type : Conference Paper

Publisher : SWISSBONDING 05: 19th International Congress of Adhesion and Bonding Technology

Source : SWISSBONDING 05: 19th International Congress of Adhesion and Bonding Technology, Lake of Zurich, Switzerland (2005)

Campus : Coimbatore

School : Department of Aerospace Engineering, School of Engineering

Department : Aerospace

Year : 2005

Abstract :

Cite this Research Publication : Shantanu Bhowmik, Weir, R. D., Bonin, H. W., and Bui, V. T., “Thermal Fatigue Behavior of Adhesive Bonding of Titanium for Aerospace Application (Invited Author)”, in SWISSBONDING 05: 19th International Congress of Adhesion and Bonding Technology, Lake of Zurich, Switzerland, 2005.

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